The **ATS-07G-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family of thermal solutions. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 25.00 mm | | **Thermal Resistance (Unducted)** | 2.91 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.67 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its specific features: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **07:** Series/Type (Cross-cut fin design). * **G:** PushPIN™ attachment type. * **128:** Specific geometry/fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code. --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design The part features a **cross-cut fin** pattern. This design is highly efficient for multi-directional airflow, meaning it can dissipate heat effectively even if the cooling fan is not perfectly aligned with the fins. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a **pushPIN™** system. It consists of: * **Brass/Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** These provide precise, uniform pressure (Force) across the thermal interface material (TIM), ensuring maximum heat transfer from the electronic component (CPU/GPU/FPGA) to the aluminum. #### C. Thermal Interface Material (TIM) The "C2" variant comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills the microscopic air gaps between the component and the heat sink to reduce thermal resistance. --- ### 4. Application This heat sink is typically used on high-heat electronic components such as: * **ASICs and FPGAs:** In networking equipment. * **Processors:** In industrial computers. * **Power Electronics:** In motor controllers or high-density power supplies. ---