The **ATS-07F-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Fin)** | 25.00 mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics The ATS-07F-95-C2-R0 utilizes a specific design architecture to maximize cooling efficiency: * **Fine Pitch Fin Design:** The "95" in the part number indicates a specific fin density. This design provides a larger surface area for heat exchange without significantly obstructing airflow. * **Push-Pin Attachment:** This mechanical fastening system uses a spring-loaded pin. It provides consistent pressure on the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). * **Blue Anodized Coating:** Beyond aesthetics, the anodization increases the emissivity of the aluminum surface, slightly improving radiative heat transfer and providing corrosion resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the variations within this series: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series number (Push-Pin type). * **F:** Fin pitch style (Fine). * **95:** Specific physical configuration/dimensions. * **C2:** Material/Finish code (typically Aluminum with Blue Anodized finish). * **R0:** RoHS compliance and revision status. --- ### 4. Application Use-Case This heat sink is typically used in: 1. **Embedded Systems:** For cooling SoCs on industrial motherboards. 2. **Telecommunications:** Cooling signal processing units in networking gear. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators where vertical space allows for a 25mm profile.