The **ATS-07F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~40 grams | --- ### 2. Physical Dimensions The "92" in the part number corresponds to a specific size profile within the ATS catalog. | Dimension | Measurement | | :--- | :--- | | **Length** | 40.00 mm | | **Width** | 40.00 mm | | **Height (Fin Height)** | 15.00 mm | | **Pitch (Hole-to-Hole)** | 33.00 mm | --- ### 3. Key Electronic Components & Design Features #### A. Fin Design: Straight Fin This model utilizes a **straight fin** geometry. This design is optimized for environments where the airflow is predictable and moves in a single direction. It provides a large surface area for heat exchange relative to its footprint. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or complex brackets, this part uses the ATS pushPIN™ system: * **Spring-loaded mechanism:** Ensures constant, even pressure across the interface of the electronic component. * **Reliability:** Reduces the risk of the heat sink shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease, ensuring low thermal resistance between the heat source and the aluminum base. --- ### 4. Typical Applications * **Telecommunications:** Cooling for line cards and routers. * **Embedded Computing:** Compact industrial PCs. * **Power Electronics:** Dissipating heat from MOSFETs and voltage regulators.