The **ATS-07F-91-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** line, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on a PCB. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Heat Sink Type** | Straight Fin | | **Thermal Resistance** | 22.01 °C/W (Unducted) | | **Flow Direction** | Vertical / Horizontal | --- ### 2. Physical Dimensions Precision is critical for board layout and component clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 10.00 mm * **Hole Spacing:** 45.00 mm (Pitch) --- ### 3. Electronic Design Components While the heat sink itself is mechanical, it integrates with electronic assemblies through three key components: #### A. The Fin Profile The **Straight Fin** design is optimized for environments with some airflow (convection). The height (10mm) is considered "low profile," making it suitable for 1U servers or slim electronic enclosures where vertical space is limited. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **plastic push-pin and spring system**. * **Mechanism:** The pin snaps into pre-drilled holes in the PCB. * **Pressure:** The spring ensures consistent downward pressure on the electronic chip, which is vital for maintaining thermal contact. #### C. Thermal Interface Material (TIM) The suffix **C3** typically indicates that the part comes with a pre-applied high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer. --- ### 4. Applications This part is commonly used for cooling: 1. **Field Programmable Gate Arrays (FPGAs)** 2. **Application-Specific Integrated Circuits (ASICs)** 3. **High-speed Networking Processors** 4. **Power MOSFETs**