The **ATS-07F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic surface-mount components. It is part of the "maxiFLOW™" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 25.0 mm x 25.0 mm | | **Height** | 30.0 mm | | **Thermal Resistance** | 2.63 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T412 (Phase-change material) | | **Airflow Design** | maxiFLOW (Tapered fin design) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system. This ensures: * **Constant Pressure:** A brass or plastic pin with a high-tension spring provides consistent force between the heatsink and the chip, improving thermal transfer. * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific TIM applied to the base. * **T412:** This is a high-performance thermal pad that softens at operating temperatures to fill microscopic air gaps between the chip surface and the aluminum base. #### C. maxiFLOW™ Fin Geometry The fins are not simple straight blocks; they are tapered and spaced to maximize surface area while minimizing pressure drop. This is critical for high-density electronic enclosures where airflow may be restricted. --- ### 3. Typical Applications This component is used to protect sensitive electronics from "Thermal Throttling" or permanent damage. Common use cases include: * **Networking Equipment:** High-speed routers and switches. * **Processors:** Cooling FPGAs, ASICs, or specialized DSPs. * **Power Supplies:** Heat dissipation for high-output voltage regulators. ---