ATS-07F-71-C2-R0
AI

The **ATS-07F-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal properties.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance (Unducted)** | 6.69 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.15 °C/W @ 200 LFM |
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### 2. Design Breakdown
The "71-C2" series features specific design elements optimized for airflow efficiency:
* **Straight Fin Pattern:** This design is ideal for systems with a clear, directed airflow (ducted or high-velocity fans). It minimizes pressure drop while maximizing the surface area for heat exchange.
* **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this part uses a mechanical push-pin system with a compression spring. This ensures:
1. **Uniform Pressure:** Constant force across the thermal interface material (TIM).
2. **Reliability:** Resistance to shock and vibration.
3. **Ease of Assembly:** Quick installation into pre-drilled PCB holes.
* **Blue Anodized Coating:** This is not just aesthetic; the anodization increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from environmental corrosion.
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### 3. Application Use Cases
This specific heat sink is typically found in:
* **Networking Equipment:** High-speed routers and switches.
* **Industrial Power Supplies:** Where thermal stability is critical for longevity.
* **Embedded Systems:** Single-board computers or FPGA modules that generate significant heat in a compact 45mm footprint.
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### 4. Thermal Interface Recommendation
To ensure the ATS-07F-71-C2-R0 functions correctly, it must be used with a **Thermal Interface Material (TIM)**.
```markdown
Recommended TIM Types:
1. Pre-applied Phase Change Material (PCM)
2. High-conductivity Thermal Grease (e.g., Arctic Silver 5 or equivalent)
3. Thermal Pads (if the component height varies slightly)
```
- ⤷
What are the specific PCB hole diameter requirements for the pushPIN™ attachment?
- ⤷ How does the thermal resistance change as airflow (LFM) increases?
- ⤷ Is there a weight limit for the components this heat sink can be mounted on?