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  • ATS-07F-71-C2-R0

  • AI
    The **ATS-07F-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance (Unducted)** | 6.69 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.15 °C/W @ 200 LFM | --- ### 2. Design Breakdown The "71-C2" series features specific design elements optimized for airflow efficiency: * **Straight Fin Pattern:** This design is ideal for systems with a clear, directed airflow (ducted or high-velocity fans). It minimizes pressure drop while maximizing the surface area for heat exchange. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this part uses a mechanical push-pin system with a compression spring. This ensures: 1. **Uniform Pressure:** Constant force across the thermal interface material (TIM). 2. **Reliability:** Resistance to shock and vibration. 3. **Ease of Assembly:** Quick installation into pre-drilled PCB holes. * **Blue Anodized Coating:** This is not just aesthetic; the anodization increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from environmental corrosion. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial Power Supplies:** Where thermal stability is critical for longevity. * **Embedded Systems:** Single-board computers or FPGA modules that generate significant heat in a compact 45mm footprint. --- ### 4. Thermal Interface Recommendation To ensure the ATS-07F-71-C2-R0 functions correctly, it must be used with a **Thermal Interface Material (TIM)**. ```markdown Recommended TIM Types: 1. Pre-applied Phase Change Material (PCM) 2. High-conductivity Thermal Grease (e.g., Arctic Silver 5 or equivalent) 3. Thermal Pads (if the component height varies slightly) ```
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameter requirements for the pushPIN™ attachment?
    • ⤷ How does the thermal resistance change as airflow (LFM) increases?
    • ⤷ Is there a weight limit for the components this heat sink can be mounted on?