The **ATS-07F-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. Below is a detailed breakdown of its specifications and design features. ### 1. General Specifications This part belongs to the **pushPIN™** series, designed for easy installation and high reliability in cooling electronic components like CPUs, GPUs, or power modules. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-07F-68-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.31 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring there is no interference with surrounding components. | Dimension | Value (mm) | | :--- | :--- | | **Width (Length)** | 45.00 mm | | **Height (Fin Height)** | 15.00 mm | | **Pitch (Mounting Hole)** | 38.00 mm | | **Weight** | ~40-50 grams (standard for this series) | --- ### 3. Thermal Performance (Deg C/W) Thermal resistance indicates how effectively the heat sink moves heat away from the component. Lower values are better. | Air Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 15.31 | 5.81 | 3.59 | | **Ducted Flow** | 3.94 | 2.59 | 2.13 | --- ### 4. Key Design Features * **Cross-Cut Fin Pattern:** The "F" in the part number often indicates a specific fin geometry designed to provide multi-directional airflow, making it effective even in turbulent or low-velocity environments. * **Push-Pin Attachment:** Uses a flexible, spring-loaded plastic or brass pin. This ensures consistent pressure on the component (Interface Pressure) and allows for quick, tool-free assembly. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a high-performance thermal pad or grease pre-applied to the base to reduce thermal resistance between the chip and the aluminum. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 5. Common Applications * **Telecom Equipment:** Cooling of high-speed network processors. * **Industrial PCs:** Thermal management for embedded boards. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.