The **ATS-07F-52-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Produced by **Advanced Thermal Solutions (ATS)**, this part belongs to their "push pin" series, designed for secure mechanical attachment to a Printed Circuit Board (PCB). --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Part Number** | ATS-07F-52-C3-R0 | | **Component Type** | Passive Heatsink | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push Pin (Plastic) | | **Fins / Pattern** | Straight Fin | | **Thermal Resistance** | Approx. 10.8°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Thermal Interface Material (TIM)** | T412 (Phase Change Material) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Aluminum) The core of the part is extruded aluminum. Aluminum is chosen for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it provides a protective layer against corrosion and slightly increases emissivity for better radiation cooling. #### 2. Push Pin Mechanism Unlike adhesive-based heatsinks, the `-R0` suffix indicates a mechanical mounting system: * **Plastic Push Pins:** Used to snap through pre-drilled holes in the PCB. * **Springs:** Each push pin is equipped with a compression spring to ensure constant, even pressure between the heatsink and the electronic chip, which is critical for efficient heat transfer. #### 3. Thermal Interface Material (TIM) The base of this part comes pre-applied with **T412**, a high-performance thermal pad. * **Function:** It fills microscopic air gaps between the chip surface and the heatsink base. * **Performance:** T412 is a "Phase Change" material that softens at operating temperatures to provide low thermal impedance. --- ### Application in Electronics This specific heatsink is typically found in: * **Networking Equipment:** Routers, switches, and bridges. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs and controllers where passive cooling is required for longevity. ---