The **ATS-07F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 19.03 °C/W (at 100 LFM) to 3.23 °C/W (at 700 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **Fin Profile (Fine Pitch):** The "F" in the part number denotes a **Fine-Pitch** fin design. This provides a high surface area-to-volume ratio, which is ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a spring-loaded pin mechanism. This ensures constant pressure (load) on the component, improving heat transfer efficiency. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766** phase-change material. This ensures an airtight thermal bond between the chip surface and the heat sink base without requiring manual application of thermal paste. * **Blue Anodized Finish:** This treatment increases the surface emissivity and protects the aluminum from oxidation and environmental wear. --- ### 3. Thermal Performance Data Thermal resistance decreases as the airflow (measured in Linear Feet per Minute - LFM) increases. | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W) - Unducted** | 19.03 | 6.35 | 3.86 | 3.23 | | **Resistance (°C/W) - Ducted** | 4.44 | 2.92 | 2.42 | 2.14 | --- ### 4. Typical Applications This specific size and performance tier are commonly found in: * **Network Switches/Routers:** Cooling ASICs and processors. * **Industrial PCs:** Cooling embedded CPU modules. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **LED Drivers:** Managing heat for high-output lighting arrays.