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  • ATS-07F-47-C2-R0

  • AI
    ## Overview of the ATS-07F-47-C2-R0 The **ATS-07F-47-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Dimension (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Thermal Resistance** | 3.69°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Fin Pattern** | Cross-Cut (Pin Fin) | --- ### Key Components and Features #### 1. Push Pin Attachment System The part number suffix **-R0** indicates the specific attachment mechanism. It uses a plastic or brass push pin with a compression spring. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the chip. * **Easy Installation:** Requires pre-drilled holes in the PCB, allowing for tool-less or simple mechanical mounting. #### 2. Cross-Cut Fin Design The heat sink features a **Pin Fin** or "Cross-Cut" geometry. This design is highly efficient for: * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, this design can accept airflow from any direction. * **Turbulence Generation:** It breaks up the air boundary layer more effectively, increasing heat dissipation. #### 3. Thermal Interface Material (TIM) It comes pre-applied with **T766**. This is a thermal pad/paste that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. #### 4. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodizing:** Provides a layer of electrical insulation and corrosion resistance while improving heat radiation (emissivity). --- ### Thermal Performance Profile The effectiveness of this heat sink varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 3.69 | | **300** | 3.11 | | **400** | 2.72 | | **500** | 2.45 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the push pin mounting?
    • ⤷ How does the T766 thermal interface material compare to high-end thermal pastes?
    • ⤷ Are there low-profile alternatives in the ATS-07F series?