ATS-07F-47-C2-R0
AI

## Overview of the ATS-07F-47-C2-R0
The **ATS-07F-47-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (with Springs) |
| **Dimension (L x W x H)** | 25.0mm x 25.0mm x 30.0mm |
| **Thermal Resistance** | 3.69°C/W (at 200 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
| **Fin Pattern** | Cross-Cut (Pin Fin) |
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### Key Components and Features
#### 1. Push Pin Attachment System
The part number suffix **-R0** indicates the specific attachment mechanism. It uses a plastic or brass push pin with a compression spring. This ensures:
* **Constant Pressure:** Maintains uniform contact between the heat sink and the chip.
* **Easy Installation:** Requires pre-drilled holes in the PCB, allowing for tool-less or simple mechanical mounting.
#### 2. Cross-Cut Fin Design
The heat sink features a **Pin Fin** or "Cross-Cut" geometry. This design is highly efficient for:
* **Omnidirectional Airflow:** Unlike straight-fin heat sinks, this design can accept airflow from any direction.
* **Turbulence Generation:** It breaks up the air boundary layer more effectively, increasing heat dissipation.
#### 3. Thermal Interface Material (TIM)
It comes pre-applied with **T766**. This is a thermal pad/paste that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance.
#### 4. Material and Coating
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and structural integrity.
* **Blue Anodizing:** Provides a layer of electrical insulation and corrosion resistance while improving heat radiation (emissivity).
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### Thermal Performance Profile
The effectiveness of this heat sink varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200** | 3.69 |
| **300** | 3.11 |
| **400** | 2.72 |
| **500** | 2.45 |
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- ⤷
What are the PCB hole size requirements for the push pin mounting?
- ⤷ How does the T766 thermal interface material compare to high-end thermal pastes?
- ⤷ Are there low-profile alternatives in the ATS-07F series?