The **ATS-07F-40-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions Inc.* and belongs to their "push-pin" attachment series. --- ### Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-07F-40-C3-R0 | | **Category** | Thermal Management - Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Shape** | Square, Fin Array | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 14.71°C/W @ Unducted Flow | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | --- ### Key Components & Features #### 1. Material and Design * **Aluminum Construction:** Aluminum is used for its high thermal conductivity and lightweight properties. * **Fin Geometry:** It features a cross-cut or pin-fin pattern designed to maximize surface area, allowing for efficient heat dissipation through convection. * **Blue Anodized Finish:** This coating is not just aesthetic; it provides corrosion resistance and increases thermal emissivity. #### 2. Attachment Mechanism (Push-Pin) This model uses a **push-pin and spring assembly** to secure the heat sink to the Printed Circuit Board (PCB). * **Springs:** Provide a consistent "preload" force, ensuring the base of the heat sink maintains firm contact with the electronic component (CPU, GPU, or ASIC). * **Brass Hardware:** The pins are made of durable brass for reliability across multiple installation cycles. #### 3. Thermal Interface Material (TIM) * The part typically comes pre-applied with **T766 thermal phase change material** or a similar high-performance grease. This fills microscopic air gaps between the component and the heat sink base to lower thermal resistance. --- ### Ideal Applications This heat sink is designed for components that generate significant heat in restricted spaces: 1. **High-speed Processors:** Small form factor CPUs or high-end FPGAs. 2. **Networking Hardware:** Routers, switches, and telecommunications equipment. 3. **Power Electronics:** Motor drivers and power supplies that require active or passive cooling.