The **ATS-07F-35-C3-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 12.58 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.55 °C/W | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Pattern** | Fine Pitch (Straight Fins) | --- ### 2. Physical Design Features * **Fin Pitch:** This model features a "fine pitch" design, which increases the surface area for heat dissipation. It is optimized for environments with high-velocity airflow. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a mechanical push-pin system with a brass or plastic pin and a compression spring. This ensures consistent pressure on the component for maximum thermal transfer. * **Low Profile:** At only 10mm in height, it is suitable for compact electronic enclosures or 1U server racks. --- ### 3. Usage Context In a circuit, the heat sink acts as a passive heat exchanger. It is typically paired with a **Thermal Interface Material (TIM)**, such as thermal grease or a pad, to bridge the microscopic air gaps between the chip surface and the aluminum base. #### Applications: * **Embedded Systems:** Cooling microcontrollers or SoCs. * **Networking:** Heat management for routers and switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions) * **07**: Series designation * **F**: Fin Type (Fine) * **35**: Size (35mm) * **C3**: Thermal Interface Material / Spring Type * **R0**: RoHS Compliant / Revision code