The **ATS-07F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 12.70mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 22.48°C/W (at 100 LFM) | | **Fin Style** | XC-Cut (Cross-cut) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses the **pushPIN™** system. This consists of: * **Compression Springs:** Provide precise pressure to ensure maximum surface contact between the heat sink and the component. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. ### B. Fin Design (XC-Cut) The "XC-Cut" refers to a cross-cut straight fin design. This is optimized for **omni-directional airflow**, meaning the heat sink performs well regardless of which direction the cooling fan is blowing across the board. ### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the unit comes with a pre-applied **Thermal Interface Material** (typically a high-performance phase-change material or grease). This eliminates the need for manual application and ensures a low-resistance path for heat to move from the chip to the aluminum fins. --- ## 3. Application Use Cases This specific heat sink is categorized as a "High-Flow" solution for medium-sized components. 1. **Telecommunications:** Used on high-speed networking chips and routers. 2. **Embedded Computing:** Cooling processors on industrial motherboards. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). --- ## 4. Performance Data (Airflow) Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.48 | | 300 (1.5 m/s) | 6.62 | | 500 (2.5 m/s) | 4.30 |