The **ATS-07F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Fin Style** | XC (Cross-Cut) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 17.50°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (Off Base)** | 15.00 mm | | **Finish** | Blue Anodized | --- ### 2. Key Components & Features #### A. The pushPIN™ Attachment Unlike adhesive tapes or clips, this model uses a **Push-Pin** system. - **Hardware:** It typically uses brass or plastic pins with a stainless steel spring. - **Benefit:** It provides uniform pressure across the component (TIM - Thermal Interface Material), ensuring better heat transfer and mechanical stability during vibration. #### B. Fin Design (XC - Cross-Cut) The "XC" designation refers to the fin geometry. - **Efficiency:** The cross-cut pattern allows for better airflow from multiple directions compared to straight-fin designs. - **Application:** Ideal for dense PCB environments where airflow direction may be unpredictable or turbulent. #### C. Material and Coating - **Aluminum:** Chosen for its excellent balance between thermal conductivity, weight, and cost. - **Blue Anodized:** The blue coating is not just aesthetic; anodizing protects the aluminum from corrosion and slightly increases emissivity for better radiant heat loss. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix | | **07** | Series/Version | | **F** | Attachment Type (Push-Pin) | | **33** | Dimension/Design Code | | **C3** | Thermal Interface Material (TIM) / Color Code | | **R0** | RoHS Compliant / Revision | --- ### 4. Typical Applications This heat sink is designed for medium-to-large surface area components that generate significant heat but have low vertical clearance (only 15mm high). Common uses include: * **CPUs/GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **Telecommunications** equipment (Routers/Switches). * **Power Supplies** and high-speed motor controllers.