The **ATS-07F-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the key specifications: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" Series | | **Material** | Aluminum | Blue Anodized Finish | | **Attachment Method** | pushPIN™ | Spring-loaded plastic/brass pins | | **Thermal Resistance** | 21.46° C/W (@ 100 LFM) | Rate of heat transfer (Unducted) | | **Dimensions** | 54mm x 54mm | Footprint size | | **Height** | 12.7mm | Low-profile design | | **Fin Type** | XCUT | Cross-cut pattern for multi-directional airflow | --- ### 2. Physical Design Features The component is engineered with several distinct electronic cooling features: * **XCUT Fin Geometry:** The fins are cut in a cross pattern. This is critical for electronic enclosures where airflow direction might be inconsistent, as it allows air to enter and exit from multiple angles. * **pushPIN™ Attachment:** Instead of messy thermal glue or simple clips, it uses a precise spring-loaded mechanism. This ensures **consistent pressure** across the component surface, which optimizes the thermal interface material (TIM) performance. * **Pre-applied TIM:** Usually comes with a high-performance phase-change thermal interface material pre-applied to the base to simplify assembly. --- ### 3. Thermal Performance Comparison Thermal resistance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 21.46 | | 300 | 1.5 | 6.07 | | 500 | 2.5 | 3.66 | | 700 | 3.5 | 2.69 | --- ### 4. Typical Applications This specific part is used in high-density electronic environments such as: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where space is limited but heat loads are high. 3. **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.