The **ATS-07F-26-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number reveals specific physical and thermal characteristics defined by the manufacturer: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin (provides high surface area) | | **Attachment Type** | Push-Pin (spring-loaded) | | **Thermal Resistance** | 14.20 °C/W (undirected airflow) to 2.02 °C/W (ducted) | | **Thermal Interface Material** | T766 (Pre-applied phase-change material) | --- ### 2. Key Electronic Components & Features #### A. The Heatsink Body * **Material:** Made of high-grade aluminum for light weight and high thermal conductivity. * **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it increases the surface emissivity, slightly improving radiation cooling and protecting against corrosion. #### B. The Push-Pin Mounting System Instead of using messy adhesives or permanent solder, this part uses a mechanical mounting system: * **Plastic/Brass Push-Pins:** Inserted through pre-drilled holes in the Printed Circuit Board (PCB). * **Springs:** Provide "Constant Pressure" (7-10 lbs/sq inch), ensuring the heatsink maintains perfect contact with the electronic chip regardless of vibration or thermal expansion. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with a pre-applied layer of T766. This is a "Phase Change Material" that softens when the electronic component gets hot, filling microscopic air gaps between the chip and the metal to maximize heat transfer. --- ### 3. Application Use Cases This specific heatsink is typically used in environments where airflow is controlled, such as: 1. **Network Switches/Routers:** Cooling the main processing ASICs. 2. **Power Supplies:** Managing heat for MOSFETs or Rectifiers. 3. **Embedded Systems:** Industrial PCs where mechanical stability (push-pins) is required over adhesive tapes. --- ### 4. Dimensional Drawing Summary * **Height:** 15.00 mm (Low profile for 1U/2U server racks). * **Base:** 40.00 mm x 40.00 mm. * **Hole Pattern:** Designed for standard PCB mounting distances (usually 33mm centers for this series).