The part number **ATS-07F-207-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment line, designed specifically for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.39°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 60mm x 60mm x 6mm | | **Fin Style** | XC-Cut (Cross-cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (Push-pin type). * **F**: Fin pitch/density indicator. * **207**: Specific geometry and sizing code. * **C2**: Material/Finish code (typically refers to Blue Anodized Aluminum). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical component, it plays a critical role in an electronic system: 1. **Thermal Management**: It increases the surface area of a semiconductor package, allowing heat to dissipate into the ambient air via convection. 2. **Performance Stability**: By keeping the junction temperature of a chip within limits, it prevents "thermal throttling," where a processor slows down to protect itself from heat. 3. **Mechanical Mounting**: The push-pin mechanism provides a consistent "clamping force" (pressure) between the heat sink and the chip, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 4. Component Comparison: Airflow Performance The effectiveness of this part varies based on the airflow (measured in Linear Feet per Minute - LFM) provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 6.39 | | **200** | 4.48 | | **300** | 3.65 | | **400** | 3.14 |