ATS-07F-184-C2-R0
AI

The **ATS-07F-184-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of their "push pin" series designed for securing the cooler to a Printed Circuit Board (PCB).
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### 1. Technical Specifications
The following table highlights the physical and thermal characteristics of this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Shape** | Square (Cross-cut for multi-directional airflow) |
| **Dimensions** | 40mm x 40mm |
| **Height** | 25mm |
| **Attachment Method** | Push Pin (with brass spring) |
| **Thermal Resistance** | 4.14°C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Part Number Breakdown (Nomenclature)
Understanding the code helps in identifying the specific variant:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **07**: Series identifier (Push-pin attachment type).
* **F**: Fin pitch/style (Fine pitch).
* **184**: Specific design/size code (40x40x25mm).
* **C2**: Material/Finish code (Blue Anodized).
* **R0**: Revision/Packaging code.
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### 3. Key Electronic Functions
While the heat sink itself does not have active circuitry, it performs critical roles in electronic assemblies:
* **Thermal Dissipation:** Its primary function is to increase the surface area of a heat-generating component (like a CPU, GPU, or MOSFET), allowing the surrounding air to carry heat away more efficiently.
* **Cross-Cut Design:** The fins are cut in both directions. This is essential for systems where airflow direction might be unpredictable or circular, as it allows air to enter and exit from any side.
* **EMI Shielding:** In some configurations, a grounded metal heat sink can provide a secondary benefit of reducing Electromagnetic Interference (EMI) from the high-frequency component it covers.
* **Mechanical Protection:** The rigid aluminum structure provides a physical buffer for delicate silicon dies against incidental contact.
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### 4. Installation and Usage
The "Push Pin" mechanism consists of a plastic or brass pin and a spring. To install this on a PCB:
1. Align the pins with the pre-drilled holes in the PCB.
2. Press down until the pin "snaps" through the board.
3. The spring provides a constant **clamping force**, ensuring the pre-applied T766 thermal grease makes perfect contact with the electronic chip.
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What are the advantages of push-pin attachments over adhesive thermal tape?
- ⤷ How does the 'LFM' (Linear Feet per Minute) rating affect the thermal performance of this heat sink?
- ⤷ Is this heat sink suitable for high-vibration environments?