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  • ATS-07F-18-C2-R0

  • AI
    The **ATS-07F-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 13.38°C/W (Unducted Flow) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 15.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### 2. Key Design Components #### A. Fin Pattern (Cross-Cut) The unit features a "Cross-Cut" fin design. Unlike straight-fin heat sinks, the cross-cut pattern allows for air to flow from multiple directions (omni-directional). This is critical in crowded PCB environments where airflow might not be perfectly linear. #### B. Push Pin Attachment Instead of using messy thermal adhesives or tapes, this model uses a mechanical **Push Pin** system with a built-in spring. * **Compression:** Provides consistent pressure on the processor/chipset for better thermal transfer. * **Stability:** Increases shock and vibration resistance. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the specific TIM applied to the base. This heat sink typically comes with a pre-applied **T766** thermal phase-change material or a high-performance thermal pad, ensuring low thermal resistance between the component and the sink. --- ### 3. Application Use Cases This specific part is sized (54mm) for medium-to-large integrated circuits. Common applications include: * **CPUs/GPUs:** Cooling embedded processors in industrial PCs. * **FPGAs:** High-speed Field Programmable Gate Arrays that generate significant heat. * **Telecommunications:** Cooling network switches and routers where vertical space is limited (15mm height). ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for this heat sink?
    • ⤷ How does the 'C2' designation in the part number affect the material or coating?
    • ⤷ What is the recommended airflow (LFM) to achieve the best thermal performance for this model?