The **ATS-07F-176-C2-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimension (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 4.40°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (pushPIN™ Heat Sink Tos). * **F**: Fin pitch/density characteristic. * **176**: Specific dimensions/geometry code. * **C2**: Material and Thermal Interface Material (TIM) code. "C2" typically indicates a specific high-performance thermal pad or grease is pre-applied. * **R0**: RoHS compliance status. --- ### 3. Key Electronic Functions #### A. Heat Dissipation The primary role is to increase the surface area of the heat-generating component. By transferring heat from the semiconductor die to the aluminum fins, the device allows airflow (either natural or forced) to carry the energy away. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Precision Springs:** Ensure consistent pressure across the interface for maximum heat transfer. * **Push-Pins:** Allow for quick and secure installation into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" variant usually comes with a pre-applied TIM. This fills the microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 4. Application Use-Cases * **Embedded Systems:** Cooling microcontrollers or small processors. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs. * **Telecommunications:** Cooling chips in routers, switches, and small-cell base stations.