The **ATS-07F-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal characteristics of the device. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum (Lightweight and high conductivity) | | **Finish** | Blue Anodized (Increases surface emissivity) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Easy mechanical mounting) | | **Thermal Resistance** | 13.52°C/W (Natural Convection) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied thermal grease) | --- ### 2. Key Design Features #### A. Fin Profile (Straight Fin) The "175" in the part number indicates a specific fin pattern. These fins increase the surface area available for heat transfer. Straight fin designs are optimized for **unidirectional airflow**, meaning they work best when a fan is blowing directly across the rows. #### B. Push-Pin Attachment Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin and Spring** mechanism: * **Reliability:** Provides consistent pressure (clamping force) against the chip. * **Serviceability:** Allows for the heat sink to be removed or replaced without damaging the PCB. * **Hole Pattern:** Usually fits standard PCB hole spacings (in this case, 40.00mm). #### C. Thermal Interface Material (TIM) The unit comes with **T766 pre-applied**. This is a phase-change material or high-performance grease that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal impedance. --- ### 3. Application Use-Cases This specific heat sink is categorized as a "Low Profile" solution (10mm height), making it ideal for: * **1U Servers:** Where vertical space is extremely limited. * **Embedded Systems:** Industrial PCs and small form factor (SFF) boards. * **Telecommunications:** Cooling ASICs and FPGAs in networking switches. --- ### 4. Thermal Performance Overview As airflow increases (measured in Linear Feet per Minute - LFM), the thermal resistance drops significantly: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 13.52 | | 300 | 1.5 | 5.13 | | 500 | 2.5 | 3.63 |