The **ATS-07F-174-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or component failure. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Fine Pitch (Square Pattern) | | **Thermal Resistance** | 3.10°C/W (at 100 LFM) | --- ### 2. Key Features and Design #### A. pushPIN™ Attachment System This part utilizes a "Push Pin" mechanism which ensures a secure fit onto the Printed Circuit Board (PCB). * **Spring-Loaded:** Provides consistent pressure across the interface to optimize thermal transfer. * **Hardware:** Usually paired with brass or plastic pins and a high-performance spring. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not only provides aesthetic appeal but also increases corrosion resistance and surface emissivity, slightly improving radiant heat transfer. #### C. Fine Pitch Fin Design The "F" in the part number indicates a fine-pitch fin geometry. This design maximizes the surface area within a small 30x30mm footprint, making it ideal for high-density electronic assemblies where airflow might be constrained but high performance is required. --- ### 3. Thermal Performance (Typical) The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow (100 LFM):** ~3.10 °C/W * **Unducted Flow (200 LFM):** ~2.30 °C/W * **Unducted Flow (500 LFM):** ~1.40 °C/W --- ### 4. Typical Applications * **CPUs and GPUs:** For small form-factor embedded systems. * **Telecommunications:** Cooling of high-speed data processing chips. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Industrial Controls:** Ensuring reliability in 24/7 operating environments. ---