The **ATS-07F-172-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | XCUT (Cross-cut) | | **Attachment Method** | pushPIN™ (Plastic push pins + Springs) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Pitch** | 1.14mm | | **Thermal Resistance** | 5.76 °C/W (at 1.0 m/s airflow) | --- ### 2. Key Design Features * **XCUT Fin Geometry:** The heat sink features a cross-cut pattern. This design allows for airflow from multiple directions, making it highly efficient for "crowded" PCBs where airflow might not be unidirectional. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a spring-loaded pin mechanism. This ensures: 1. **Uniform Pressure:** Constant force is applied to the thermal interface material (TIM). 2. **Reliability:** It is more resistant to shock and vibration compared to tape. 3. **Easy Installation:** Pins snap into pre-drilled holes (approx. 3.175mm) on the PCB. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and effective thermal conductivity. --- ### 3. Thermal Performance Data Thermal resistance indicates how effectively the part moves heat away from the component. Lower values are better. | Airflow Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Unducted) | 5.76 | | 2.0 (Unducted) | 3.51 | | 3.0 (Unducted) | 2.85 | --- ### 4. Typical Applications This specific size (30x30mm) is commonly used for: * **Networking Equipment:** Routers, switches, and modems. * **Embedded Systems:** Industrial PC boards and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules. ---