The **ATS-07F-155-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, into the surrounding air. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 5.37°C/W (Unducted Flow @ 1.0 m/s) | --- ### 2. Key Components & Design Features #### A. XC-Cut Fin Design The "XC" designation refers to the **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in high-density PCB layouts where airflow may not be strictly linear, ensuring efficient cooling from various angles. #### B. Push-Pin Attachment The component uses the **pushPIN™** system, which consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide consistent downward pressure to ensure maximum contact between the heat sink and the heat source. * **Thermal Interface Material (TIM):** The base usually comes pre-applied with a high-performance thermal pad or paste to eliminate air gaps. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower numbers are better. | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (200 LFM) | 5.37 | | 2.0 (400 LFM) | 2.50 | | 3.0 (600 LFM) | 1.91 | --- ### 4. Common Applications * **Embedded Systems:** Cooling microprocessors and FPGAs. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Dissipating heat from Voltage Regulators and DC-DC converters.