The **ATS-07F-154-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown of its technical profile: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 40mm x 40mm x 15mm | --- ### 2. Physical Design and Dimensions The "C2" in the part number indicates the material and finish, while the "R0" typically refers to the revision or packaging style. * **Footprint:** 40mm x 40mm square base. * **Height:** 15.00mm (Low profile, suitable for 1U or 2U server rack enclosures). * **Fin Pattern:** It uses a **square-fin (cross-cut)** pattern. This design allows air to flow from multiple directions (omnidirectional), which is ideal for systems where the airflow direction might be inconsistent. --- ### 3. Electronic Attachment System: pushPIN™ Unlike adhesive-based heat sinks, this model uses the **pushPIN™** system, which is critical for electronic reliability: * **Mechanical Stability:** Uses a brass or plastic pin with a high-tension compression spring. * **Thermal Interface Material (TIM):** Usually comes pre-applied with **T766** (a high-performance thermal phase-change material) to ensure no air gaps exist between the chip and the aluminum base. * **Reusability:** Allows for the heat sink to be removed and reattached during maintenance without damaging the PCB (Printed Circuit Board). --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (degrees Celsius per Watt). A lower number indicates better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.51 | | 300 (1.5 m/s) | 3.43 | | 500 (2.5 m/s) | 2.53 | | 700 (3.5 m/s) | 2.11 | --- ### 5. Common Applications * **Telecommunications:** Cooling of high-speed networking ASICs. * **Embedded Computing:** Industrial PCs where fans might be small or distant. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.