The **ATS-07F-147-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits on a PCB. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimension (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 10.00 mm | | **Fin Style** | Straight | | **Thermal Resistance** | ~13.65 °C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (Push-pin attachment). * **F**: Fin pitch/density indicator. * **147**: Unique identifier for the specific dimensions (35mm x 35mm x 10mm). * **C3**: Indicates the thermal performance level and material (typically Aluminum with a specific anodized color). * **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Components Features #### A. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **Push-Pin** system provides a secure mechanical connection. It uses a spring-loaded mechanism that applies constant pressure on the component, ensuring maximum contact with the heat source and improving thermal transfer efficiency. #### B. Thermal Interface Material (T412) The "C3" variant often comes pre-applied with **T412**, which is a high-performance thermal tape. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a uniform layer between the heat sink and the chip. #### C. Straight Fin Design The straight fin geometry is optimized for **forced air cooling**. It allows air from a system fan to flow through the channels with minimal resistance, effectively carrying heat away from the base plate. --- ### 4. Typical Applications This heat sink is commonly found in: * **Embedded Systems:** Cooling small-form-factor processors. * **Networking Gear:** Cooling ASICs in switches and routers. * **Power Supplies:** Dissipating heat from power transistors or VRMs.