The **ATS-07F-137-C2-R0** is a specific model of a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the "blue ANODIZED" family and is designed for high-performance cooling of electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07F-137-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Style** | push-PIN™ | | **Thermal Resistance** | 18.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 18.00mm x 18.00mm x 7.00mm | | **Fin Type** | XCUT (Cross-cut / Pin Fin) | --- ### 2. Key Components & Design Features #### A. The XCUT Profile (Fin Design) Unlike straight-fin heat sinks, the XCUT design features a cross-cut pattern. This allows for: * **Omnidirectional Airflow:** Air can enter and exit the heat sink from multiple directions, making it ideal for enclosures where airflow direction is inconsistent. * **Increased Surface Area:** The "pin-like" structure increases the total surface area available for heat dissipation. #### B. push-PIN™ Attachment Mechanism The "07F" designation indicates the mounting hardware used. * **Spring-loaded Pins:** It uses a push-pin system with a brass or plastic pin and a stainless steel spring. * **Consistent Pressure:** This ensures high-performance thermal interface material (TIM) contact between the heat sink and the component, minimizing thermal resistance at the interface. #### C. Material and Coating * **Aluminum 6063:** Lightweight with excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly increases "surface emissivity," which aids in radiation cooling. --- ### 3. Electronic Application Usage This part is typically used in space-constrained electronic environments: 1. **Telecommunications:** Cooling small chipsets in routers or switches. 2. **Embedded Systems:** Industrial PCs where vertical clearance (height) is limited to 7mm. 3. **Power Electronics:** Dissipating heat from small MOSFETs or voltage regulators that require more than just PCB copper traces for cooling. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 18.30 | | 300 | 1.5 | 12.85 | | 500 | 2.5 | 11.10 |