The part number **ATS-07F-133-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific component is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 10mm (Low Profile) | | **Thermal Resistance** | 7.42°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Component Breakdown The part number can be decoded to understand its structural features: * **Heat Sink Body:** A 70mm square aluminum block with vertical fins. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses mechanical plastic pins. This provides constant pressure for better thermal contact and makes the part reusable or easy to service. * **Springs:** The "C2" designation often refers to the specific spring tension (Brass) which ensures a secure fit against the chip without cracking the silicon die. * **Thermal Interface Material (TIM):** The "-R0" indicates it comes with a pre-applied layer of thermal pad/grease, specifically the **T766** material, which fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This component is typically used in the following electronic environments: 1. **Telecommunications:** Cooling ASICs in networking switches and routers. 2. **Embedded Computing:** Providing heat dissipation for low-profile industrial PC motherboards. 3. **Power Electronics:** Cooling large voltage regulators or motor drivers where vertical space is limited (due to its 10mm height). --- ### 4. Cooling Performance (LFM - Linear Feet per Minute) The efficiency of this heat sink depends heavily on the airflow provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 7.42 | | 300 (Moderate) | 2.58 | | 500 (High) | 1.78 |