The **ATS-07E-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-07E-76-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 15.0mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | ~11.5°C/W (Natural Convection) | --- ## Key Components and Design Features ### 1. The Fin Design (Fine Pitch) The "76" in the part number indicates a specific fin density. This model uses a **Fine Pitch** pattern, which maximizes the surface area within a small 25mm footprint. This is ideal for high-velocity airflow environments where heat needs to be dissipated quickly from a small chip surface. ### 2. pushPIN™ Attachment Mechanism This part utilizes a specialized mounting system rather than simple adhesive: * **Brass Bolts/Pins:** Secure the heat sink to the PCB. * **Compression Springs:** Provide precise, uniform pressure across the component to ensure optimal thermal contact. * **Flexibility:** It allows for easy installation and removal without damaging the sensitive electronic components. ### 3. Thermal Interface Material (TIM) The "C2" designation typically refers to the pre-applied thermal material. ATS uses high-performance thermal grease or pads to fill the microscopic air gaps between the heat sink base and the electronic chip (CPU/GPU/FPGA), significantly reducing thermal resistance. ### 4. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ## Common Applications * **Network Switches/Routers:** Cooling small, high-heat processors. * **Embedded Systems:** For compact PCBs where space is restricted. * **Power Supplies:** Managing heat in voltage regulators and transistors. * **Industrial Controls:** Ensuring stability in high-temperature environments.