The **ATS-07E-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, ASICs, and chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Dimension (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 7.51 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Construction The "electronic parts" of this assembly focus on mechanical and thermal engineering to protect sensitive circuitry: * **Heat Sink Body:** The 40mm square base is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. * **Fin Geometry:** It features a **Straight-Fin** design. This is optimized for airflow directed across the board, allowing heat to dissipate from the surface of the component into the ambient air. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 3. Attachment Mechanism (Push Pin) The "R0" suffix refers to the specific mounting hardware. Instead of adhesive tape, it uses a mechanical fastening system: 1. **Push Pins:** These are spring-loaded pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These ensure constant, even pressure on the chip, which prevents the heat sink from shifting during vibration or thermal expansion. 3. **Hole Pattern:** The attachment is designed for a specific hole spacing (usually 33mm in this series) to ensure compatibility with standard PCB layouts. --- ### 4. Key Applications * **Networking:** Cooling for routers and switches. * **Power Supplies:** Managing heat in high-efficiency conversion modules. * **Embedded Systems:** For industrial PCs where space is limited but thermal loads are high.