The **ATS-07E-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, specifically designed for cooling electronic components such as CPUs, GPUs, FPGAs, and power modules. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-07E-151-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 30mm | | **Thermal Resistance** | 3.93°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Interface (TIM)** | T766 (Pre-applied thermal grease) | --- ### 2. Key Components & Design Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "E" in the part number indicates a **pushPIN™** system. * **Mechanical Stability:** It uses a compression spring and pin mechanism to ensure a precise, firm fit. * **Pressure:** The spring provides consistent pressure across the interface, maximizing heat transfer. * **Reliability:** It is more secure than tape/adhesive in high-vibration environments. #### B. Heat Sink Geometry (XC - Cross-Cut) This model features a **Cross-Cut** fin design. * **Airflow:** This allows air to flow through the fins from multiple directions, making it ideal for systems where the direction of the fan exhaust might vary. * **Efficiency:** The high fin density increases the surface area for heat dissipation. #### C. Thermal Interface Material (TIM) The **C2** in the part number signifies that it comes with **T766 thermal grease** pre-applied. * **Function:** T766 is a high-performance material that fills microscopic air gaps between the component and the heat sink base to lower thermal impedance. --- ### 3. Electronic Application Use-Cases The ATS-07E-151-C2-R0 is typically used for cooling: 1. **High-Speed Processors:** Small form factor CPUs or embedded processors. 2. **Power Electronics:** MOSFETs or IGBTs that generate significant heat in a 35x35mm footprint. 3. **Networking Hardware:** ASICs found in routers and high-speed switches.