The part number **ATS-07E-101-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components such as BGA (Ball Grid Array) packages. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | superGRIP™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimension (Length/Width)** | 45mm x 45mm | | **Height** | 30mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Clip-On (Frame and Spring Clip) | | **Thermal Resistance** | ~6.69°C/W (at 200 LFM) | --- ### 2. Breakdown of the Part Number The code follows a specific nomenclature used by ATS to identify the physical and thermal properties of the component: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series identifier (superGRIP attachment system). * **E**: Attachment type (Spring Clip version). * **101**: Specific geometry/footprint code (45mm x 45mm). * **C2**: Material and Finish code (**C2** typically indicates **Blue Anodized** aluminum). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Cooling Features 1. **superGRIP™ Attachment**: This system uses a plastic frame that clips onto the component (like a CPU or FPGA) and a metal spring clip that applies constant pressure to the heat sink. This avoids the need to drill holes in the PCB. 2. **Straight Fin Design**: The fins are aligned in parallel rows. This design is optimized for **forced air cooling** (where a fan blows air through the fins), offering low pressure drop. 3. **Phase Change Material (PCM)**: These units often come with a pre-applied Thermal Interface Material (TIM) on the base to ensure efficient heat transfer from the chip to the aluminum. 4. **Application**: Primarily used for cooling high-heat components such as: * FPGAs (Field Programmable Gate Arrays) * Processors (CPUs/GPUs) * Telecommunication ASICs --- ### 4. Thermal Performance Thermal resistance is the measure of how well the part dissipates heat. For the ATS-07E-101-C2-R0: * **Unducted Flow:** Higher resistance (less efficient) in still air. * **Ducted/Forced Flow:** Performance increases significantly as airflow (Measured in Linear Feet per Minute - LFM) increases.