ATS-07D-98-C2-R0
AI

The **ATS-07D-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended for cooling integrated circuits (ICs) and high-power electronic components.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 15.31°C/W (Unducted) |
| **Dimensions** | 45mm x 45mm |
| **Height (Fin)** | 20mm |
| **Fin Style** | Cross-Cut (Pin Fin) |
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### 2. Physical Design & Engineering
The "C2" and "R0" designations in the suffix provide details about the material and finish:
* **Fin Configuration:** It uses a **Cross-Cut** pattern. Unlike straight fins, cross-cut fins (often called pin fins) allow for omni-directional airflow, making them more efficient in systems where the exact direction of air current might fluctuate.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance phase-change material that ensures maximum heat transfer between the chip and the aluminum base.
* **Mounting System:** It uses the **pushPIN™** system, which involves plastic or brass pins and a compression spring. This ensures a consistent pressure (Force) is applied to the component, preventing damage while maintaining thermal contact.
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### 3. Application Use Cases
This heatsink is generally found in high-reliability electronic environments:
1. **Telecommunications:** Cooling of high-speed processors in routers and switches.
2. **Embedded Systems:** Used on SoCs (System on Chips) that generate significant heat in compact enclosures.
3. **Power Electronics:** Managing heat for MOSFETs or high-density power modules.
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### 4. Part Number Breakdown (Pattern)
| Segment | Meaning |
| :--- | :--- |
| **ATS-07** | ATS Series Identifier |
| **D** | Material / Design code |
| **98** | Specific dimension/fin layout index |
| **C2** | Thermal Interface Material (T766) / Performance level |
| **R0** | RoHS Compliant / Revision code |
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What is the significance of the pushPIN mounting system compared to adhesive tape?
- ⤷ How does 'unducted' thermal resistance differ from 'ducted' performance in this model?
- ⤷ Is this heatsink compatible with BGA or LGA packages?