The **ATS-07D-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Fin Style** | Straight (Cross-Cut) | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 7.37°C/W (at 100 LFM) | | **Pressure Drop** | 0.15 inH2O (at 100 LFM) | --- ### 2. Key Components & Construction The "electronic" functionality of this part relates to its ability to dissipate heat generated by semiconductors (CPUs, GPUs, FPGAs, or Power Transistors). * **Heat Sink Body:** Constructed from high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation heat transfer. * **Fin Design:** It uses a high-performance **cross-cut** pattern. This creates a large surface area for air to pass through, significantly reducing the junction temperature of the underlying electronic component. * **Mounting Interface (Push-Pins):** It utilizes brass or plastic pins with a compression spring. This ensures a constant, specific pressure (load) on the electronic chip, which is critical for maintaining thermal contact without cracking the silicon die. ### 3. Application Use Cases This specific model is typically used in environments where active or passive airflow is present: 1. **Telecommunications:** Networking switches and routers. 2. **Power Supplies:** Cooling MOSFETs or Voltage Regulators. 3. **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (provided by the push-pin locks). --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 7.37 | | **200** | 3.70 | | **300** | 2.90 | | **400** | 2.40 |