The **ATS-07D-91-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Dimensions** | 40mm x 40mm x 10.00mm | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 22.01°C/W (at natural convection) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T412 (Thermal Interface Material pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Key Component Analysis #### A. The Fin Design (Straight Fin) The "Straight Fin" geometry is optimized for **forced air cooling** (using fans). The parallel fins allow air to flow through the channels with minimal pressure drop, which is critical for maintaining low temperatures in high-density PCB environments. #### B. Attachment Mechanism (Push-Pin) This part utilizes a **Push-Pin and Spring** mechanism: * **Plastic Push-Pins:** Provide a secure and vibration-resistant attachment to the PCB. * **Compression Springs:** Ensure consistent downward pressure on the electronic component, which improves thermal contact and prevents the heat sink from shifting. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, a high-performance phase-change material. * **Function:** It fills microscopic air gaps between the heat sink base and the chip surface. * **Advantage:** Eliminates the need for manual thermal paste application during assembly, reducing production time. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** Cooling network switches and routers. 2. **Industrial PC (IPC):** Managing heat for embedded processors. 3. **Power Electronics:** Dissipating heat from MOSFETs or large power regulators. --- ### 4. Comparison of Thermal Resistance (Airflow Dependent) Thermal performance improves significantly as the velocity of airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 22.01 | | 300 | 5.51 | | 500 | 3.52 |