The **ATS-07D-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.84°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **Fin Style** | Straight (Fine Pitch) | --- ### Key Electronic & Physical Features #### 1. Heat Sink Design (Straight Fin) The "76" in the part number refers to a specific fin configuration. Straight fins are optimized for **forced air cooling** (convection). They provide a large surface area to transfer heat from the semiconductor junction to the surrounding air. #### 2. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **push-pin and spring** mechanism. * **Reliability:** Ensures consistent pressure (clamping force) across the component for optimal thermal transfer. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### 3. Thermal Interface Material (TIM) The "C3" designation typically indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a conductive phase-change material or grease that fills microscopic air gaps between the component and the heat sink. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; **Anodization** increases: * **Emissivity:** Improving heat radiation. * **Corrosion Resistance:** Protecting the aluminum from environmental degradation. * **Electrical Insulation:** Providing a non-conductive surface to prevent accidental shorts. --- ### Thermal Performance Table The efficiency of the ATS-07D-76-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.84 | | 300 (1.5 m/s) | 4.41 | | 500 (2.5 m/s) | 3.17 | | 700 (3.5 m/s) | 2.64 | --- ### Application Usage This part is commonly found in: * **Small Form Factor (SFF) Electronics:** Due to its compact 25mm footprint. * **Telecommunications:** Cooling ASICs and FPGAs. * **Embedded Systems:** Industrial PCs where vibration resistance (via push-pins) is required.