The **ATS-07D-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number provides specific details about its construction and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 5.19 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.15 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Pitch** | Fine Pitch | --- ### 2. Key Components & Design The ATS-07D-72-C3-R0 features several engineering choices optimized for electronic cooling: * **Fins:** It utilizes a **Straight Fin** design. These are vertically aligned plates that increase the surface area available for convection. * **pushPIN™ Attachment:** This is a specialized mounting mechanism that uses a spring-loaded pin to ensure consistent pressure between the heat sink and the component, maximizing heat transfer. * **Thermal Interface Material (TIM):** This model typically comes with a pre-applied **T412** thermal tape or pad, which fills microscopic air gaps between the heat sink base and the electronic chip. --- ### 3. Application Use Cases This specific heat sink is used in environments where airflow is directed across the PCB. Common applications include: 1. **Telecommunications:** Cooling ASICs in networking switches or routers. 2. **Power Supplies:** Managing heat in high-efficiency DC-DC converters. 3. **Embedded Systems:** Industrial PCs where space is limited but high thermal dissipation is required. --- ### 4. Thermal Performance Comparison Below is a simplified representation of how air velocity (Measured in Linear Feet per Minute) affects the thermal resistance of this part: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.19 | | 300 (1.5 m/s) | 2.91 | | 500 (2.5 m/s) | 2.39 | | 700 (3.5 m/s) | 2.15 | ---