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  • ATS-07D-71-C2-R0

  • AI
    The **ATS-07D-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Electronic Application & Usage This part is categorized as a **Passive Thermal Management** component. Its primary function is to increase the surface area of a heat-generating electronic device to dissipate thermal energy into the surrounding air. #### Key Electronic Considerations: * **Thermal Impedance:** It is designed to lower the junction temperature ($T_j$) of semiconductors to prevent thermal throttling or hardware failure. * **Acoustic Profile:** As a passive heat sink, it generates no noise, making it ideal for fanless or low-noise electronic enclosures. * **EMI Shielding:** Because it is made of aluminum, it can sometimes influence the Electromagnetic Interference (EMI) profile of a board, depending on its grounding and proximity to high-frequency traces. --- ### 3. Mounting and Material Details * **Push Pin Mechanism:** The "C2" in the part number indicates a specific push-pin and spring combination. This provides consistent pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for radiant heat transfer. ---
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do I calculate the thermal resistance for different airflow speeds?
    • ⤷ What are the PCB hole requirements for the push pin mounting?