The **ATS-07D-65-C2-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push pin" series, designed for cooling high-performance integrated circuits (ICs). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-07D-65-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 7.22°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fins** | Cross-Cut (Pin Fin type) | --- ## Key Components and Design Features ### 1. The Heat Sink Body The body is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "Blue Anodized" finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. ### 2. Fin Geometry (Cross-Cut) Unlike traditional straight-fin heat sinks, this model uses a **Cross-Cut** or pin-fin design. - **Efficiency:** This allows for omnidirectional airflow, meaning it can accept air from any direction, making it ideal for crowded PCB layouts. - **Surface Area:** The structure maximizes the surface area exposed to the air to dissipate heat from the component beneath. ### 3. Attachment Mechanism (Push Pins) The "07D" series specifically utilizes a push-pin attachment system: - **Spring Loading:** The pins are usually accompanied by springs that provide consistent downward pressure, ensuring a tight interface between the chip and the heat sink. - **Hardware:** It requires pre-drilled holes in the Printed Circuit Board (PCB). ### 4. Thermal Interface Material (TIM) The "R0" suffix typically indicates the inclusion of a pre-applied **Thermal Interface Material**. In this case, it usually comes with **T766**, a high-performance phase-change material that fills microscopic air gaps between the IC and the heat sink base. --- ## Applications This part is commonly used for cooling: * **CPUs/GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **ASICs** (Application-Specific Integrated Circuits). * High-speed networking chips.