The **ATS-07D-62-C2-R0** is a specific electronic component produced by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, FPGAs, or power modules. --- ## Technical Specifications The following table outlines the key technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07D-62-C2-R0 | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Fin Type** | Straight Fin (Blue Anodized) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | | **Material** | Aluminum | --- ## Key Electronic Features ### 1. Thermal Management The primary electronic function of this part is **passive cooling**. By increasing the surface area of the heat-generating component, it prevents thermal throttling or permanent damage to integrated circuits (ICs). ### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism. This ensures: * **Consistent Pressure:** Even contact across the electronic chip surface. * **Vibration Resistance:** Securely fastened for industrial or high-vibration environments. * **Reusability:** Can be removed and reattached during hardware maintenance. ### 3. Pre-applied TIM (Thermal Interface Material) The part comes with **T766** material pre-applied to the base. In electronics, this fills the microscopic air gaps between the heat sink and the chip, significantly reducing thermal impedance. --- ## Dimensions and Mechanicals | Dimension | Value | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Pitch** | 45.00 mm (Hole-to-hole spacing) | --- ## Performance Summary The efficiency of this electronic part depends on the airflow (LFM - Linear Feet per Minute) within the device enclosure: * **Low Airflow (100 LFM):** 16.48 °C/W * **High Airflow (700 LFM):** 2.59 °C/W This data indicates that the part is highly sensitive to the cooling fans used within the electronic assembly.