The **ATS-07D-55-C2-R0** is an electronic thermal management component, specifically a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Line** | pushPIN™ Heat Sink | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 35mm x 35mm x 10mm (Low Profile) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~23.98 °C/W (Unducted Flow) | | **Thermal Interface** | T766 (Pre-applied thermal grease) | --- ### 2. Physical Design & Components The "Electronic" functionality of this part is passive, meaning it does not require power to operate but is critical for the survival of active electronics. * **The Heat Sink Body:** Made of high-grade aluminum. The 10mm height makes it ideal for **1U servers** or small form factor (SFF) enclosures where vertical space is limited. * **Push-Pin Attachment:** The part includes a spring-loaded push-pin mechanism. This ensures constant pressure between the heat sink and the chip, which is vital for efficient heat transfer. * **Fin Geometry:** The straight fin design allows for airflow from a cooling fan to pass through easily, reducing the "pressure drop" across the component. * **Thermal Interface Material (TIM):** The **C2** in the part number indicates it comes with a high-performance thermal pad/grease pre-applied to the base, ensuring no air gaps exist between the chip and the metal. --- ### 3. Application Use Cases This specific model is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of signal processing chips in networking switches. 2. **Embedded Systems:** Protecting microcontrollers in industrial automation. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 07 D - 55 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material (T766) | | +------------ Height (10mm) | +----------------- Fin Pitch/Type +----------------------- Advanced Thermal Solutions ```