ATS-07D-54-C2-R0
AI

The **ATS-07D-54-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
| **Fin Type** | Fine Pitch (Straight Fin) |
| **Flow Orientation** | Vertical/High Performance |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
- **ATS-07**: Series designation (Push-pin heat sink series).
- **D**: Material/Fin density classification.
- **54**: Specific dimensional footprint code.
- **C2**: Specific height and thermal performance profile.
- **R0**: Revision or standard packaging indicator.
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### 3. Electronic Design Features
#### A. Attachment Mechanism
The "Push-Pin" design uses a spring-loaded brass pin. This provides:
* **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic chip, optimizing heat transfer.
* **Reliability:** Avoids the "creep" associated with thermal adhesives over time.
#### B. Thermal Interface Material (T766)
This part comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the component, significantly reducing thermal resistance.
#### C. Airflow Optimization
The straight-fin design is optimized for systems with **forced air cooling** (fans). The 35mm height allows for a large surface area, making it suitable for high-wattage components in 1U or 2U rack-mount servers or industrial computers.
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### 4. Typical Applications
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators or power transistors.
- ⤷
What are the specific thermal resistance values for this heat sink under different airflow speeds?
- ⤷ How does the push-pin mounting compare to adhesive-based heat sink mounting?
- ⤷ Is this heat sink compatible with standard 35mm x 35mm BGA components?