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  • ATS-07D-54-C2-R0

  • AI
    The **ATS-07D-54-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Flow Orientation** | Vertical/High Performance | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: - **ATS-07**: Series designation (Push-pin heat sink series). - **D**: Material/Fin density classification. - **54**: Specific dimensional footprint code. - **C2**: Specific height and thermal performance profile. - **R0**: Revision or standard packaging indicator. --- ### 3. Electronic Design Features #### A. Attachment Mechanism The "Push-Pin" design uses a spring-loaded brass pin. This provides: * **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic chip, optimizing heat transfer. * **Reliability:** Avoids the "creep" associated with thermal adhesives over time. #### B. Thermal Interface Material (T766) This part comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the component, significantly reducing thermal resistance. #### C. Airflow Optimization The straight-fin design is optimized for systems with **forced air cooling** (fans). The 35mm height allows for a large surface area, making it suitable for high-wattage components in 1U or 2U rack-mount servers or industrial computers. --- ### 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or power transistors.
    ✨ Follow-up Questions
    • ⤷ What are the specific thermal resistance values for this heat sink under different airflow speeds?
    • ⤷ How does the push-pin mounting compare to adhesive-based heat sink mounting?
    • ⤷ Is this heat sink compatible with standard 35mm x 35mm BGA components?