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  • ATS-07D-34-C2-R0

  • AI
    The **ATS-07D-34-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to handle high heat loads in environments with constrained airflow. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 57.60mm x 36.83mm x 22.86mm | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance (Unducted)** | 6.73 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.15 °C/W | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This part is not just a block of metal; it is engineered for specific electronic cooling behaviors: * **Tapered Fin Design:** The "maxiFLOW" geometry features a spread-fin pattern. This increases the surface area while reducing pressure drop, allowing air to flow more freely through the fins. * **pushPIN™ Attachment:** It uses a specialized spring-loaded mechanism. This ensures a consistent and reliable pressure (clamping force) on the electronic component (CPU, GPU, or FPGA), which is critical for efficient heat transfer. * **Pre-Applied TIM:** The unit comes with **T766** thermal grease already applied to the base. This eliminates the need for manual application and ensures there are no air gaps between the chip and the heat sink. --- ### 3. Common Applications The ATS-07D-34-C2-R0 is typically used for cooling mid-to-high-power electronic components in the following sectors: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and high-speed processing units. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 6.73 | | 300 | 2.30 | | 500 | 1.51 | | 700 | 1.23 |
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the pushPIN attachment over adhesive tapes?
    • ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
    • ⤷ Can this heat sink be used for high-altitude electronic applications?