ATS-07D-34-C2-R0
AI

The **ATS-07D-34-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to handle high heat loads in environments with constrained airflow.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this component:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 57.60mm x 36.83mm x 22.86mm |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance (Unducted)** | 6.73 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.15 °C/W |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design Characteristics
This part is not just a block of metal; it is engineered for specific electronic cooling behaviors:
* **Tapered Fin Design:** The "maxiFLOW" geometry features a spread-fin pattern. This increases the surface area while reducing pressure drop, allowing air to flow more freely through the fins.
* **pushPIN™ Attachment:** It uses a specialized spring-loaded mechanism. This ensures a consistent and reliable pressure (clamping force) on the electronic component (CPU, GPU, or FPGA), which is critical for efficient heat transfer.
* **Pre-Applied TIM:** The unit comes with **T766** thermal grease already applied to the base. This eliminates the need for manual application and ensures there are no air gaps between the chip and the heat sink.
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### 3. Common Applications
The ATS-07D-34-C2-R0 is typically used for cooling mid-to-high-power electronic components in the following sectors:
1. **Telecommunications:** Network switches and routers.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Voltage regulators and high-speed processing units.
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### 4. Thermal Performance Comparison
Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 6.73 |
| 300 | 2.30 |
| 500 | 1.51 |
| 700 | 1.23 |
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What are the advantages of the pushPIN attachment over adhesive tapes?
- ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
- ⤷ Can this heat sink be used for high-altitude electronic applications?