The **ATS-07D-33-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35mm x 35mm x 20mm | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Physical Design & Engineering The "Electronic Parts" aspect of this component focuses on its physical architecture to maximize heat transfer: * **Straight Fin Geometry:** This design allows for low-pressure drop and is optimized for airflow moving in a single direction across the PCB. * **Push-Pin Mounting:** Unlike adhesive-only heat sinks, this uses a spring-loaded push-pin mechanism. This provides **consistent pressure** across the component surface, which improves the "wetting" of the thermal interface material (TIM). * **Pre-Assembled TIM:** It typically comes with a high-performance thermal interface material pre-applied to the base, ensuring there are no air gaps between the heat sink and the electronic chip. --- ### 3. Thermal Performance Profile Thermal management is measured by how much the temperature rises per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.42 | | 300 (1.5 m/s) | 4.12 | | 500 (2.5 m/s) | 2.90 | *Note: As airflow increases, the efficiency of the heat sink improves drastically.* --- ### 4. Typical Applications * **Networking Equipment:** Routers and switches with high-speed processing chips. * **Embedded Systems:** Industrial PCs where mechanical stability (push-pins) is required over simple adhesive. * **Power Supplies:** Cooling voltage regulators or MOSFETs.