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  • ATS-07D-31-C2-R0

  • AI
    The **ATS-07D-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table outlines the core electronic and physical characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 25.25°C/W (at 100 LFM / 0.5 m/s) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | --- ### 2. Key Components & Design The "pushPIN™" system used in this part is designed to provide secure attachment and high thermal efficiency for PCB-mounted components. * **Fin Profile:** It utilizes a **straight-fin** or **cross-cut** design (depending on the specific sub-series) to maximize surface area contact with air. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance thermal pad (T766) to ensure a low-resistance path between the electronic component (CPU, FPGA, or MOSFET) and the aluminum sink. * **Compression Springs:** The hardware uses a precise tension spring to ensure constant pressure on the semiconductor, which prevents air gaps and compensates for thermal expansion. --- ### 3. Application Use Cases This heat sink is typically used for cooling small to medium-sized electronic chips in the following sectors: 1. **Telecommunications:** Cooling of routers and network switches. 2. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators. 3. **Industrial Computing:** Maintaining safe operating temperatures for microprocessors in compact enclosures. --- ### 4. Thermal Performance Comparison The performance of the ATS-07D-31-C2-R0 varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 25.25 | | 200 | 1.0 | 11.42 | | 500 | 2.5 | 4.88 | | 700 | 3.5 | 3.69 |
    ✨ Follow-up Questions
    • ⤷ What are the specific hole dimensions required on the PCB for this push-pin mount?
    • ⤷ Can this heat sink be customized with different thermal interface materials?
    • ⤷ How does the 'C2' designation in the part number affect its thermal properties?