ATS-07D-31-C2-R0
AI

The **ATS-07D-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS).
### 1. Technical Specifications
The following table outlines the core electronic and physical characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Heat Sink Type** | Top Mount |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 25.25°C/W (at 100 LFM / 0.5 m/s) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 35.00mm x 35.00mm x 10.00mm |
---
### 2. Key Components & Design
The "pushPIN™" system used in this part is designed to provide secure attachment and high thermal efficiency for PCB-mounted components.
* **Fin Profile:** It utilizes a **straight-fin** or **cross-cut** design (depending on the specific sub-series) to maximize surface area contact with air.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance thermal pad (T766) to ensure a low-resistance path between the electronic component (CPU, FPGA, or MOSFET) and the aluminum sink.
* **Compression Springs:** The hardware uses a precise tension spring to ensure constant pressure on the semiconductor, which prevents air gaps and compensates for thermal expansion.
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### 3. Application Use Cases
This heat sink is typically used for cooling small to medium-sized electronic chips in the following sectors:
1. **Telecommunications:** Cooling of routers and network switches.
2. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators.
3. **Industrial Computing:** Maintaining safe operating temperatures for microprocessors in compact enclosures.
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### 4. Thermal Performance Comparison
The performance of the ATS-07D-31-C2-R0 varies based on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 25.25 |
| 200 | 1.0 | 11.42 |
| 500 | 2.5 | 4.88 |
| 700 | 3.5 | 3.69 |
- ⤷
What are the specific hole dimensions required on the PCB for this push-pin mount?
- ⤷ Can this heat sink be customized with different thermal interface materials?
- ⤷ How does the 'C2' designation in the part number affect its thermal properties?