The **ATS-07D-23-C2-R0** is a specific electronic cooling component, specifically a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with springs) | | **Dimensions** | 60mm x 60mm | | **Height** | 15mm | | **Thermal Resistance** | 12.01 °C/W (at 100 LFM) | | **Flow Orientation** | Vertical or Horizontal (depending on airflow) | --- ### 2. Breakdown of the Part Number The part number is a coded string that defines the physical and thermal characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series identifier (pushPIN™ Heat Sink). * **D**: Material type (Aluminum). * **23**: Length/Width dimension code (60mm). * **C2**: Finish and Material color (Blue Anodized). * **R0**: Versioning/Revision code. --- ### 3. Key Features and Applications The ATS-07D-23-C2-R0 is designed for versatility in modern electronics. #### Features: * **Push Pin Attachment:** Uses a spring-loaded mechanism to provide precise pressure for maximum heat transfer. * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with high-performance thermal tape or grease pre-applied to the base. * **Cross-Cut Design:** The fins are often designed to allow airflow from multiple directions, improving efficiency in cramped server or networking enclosures. #### Common Applications: * **CPUs/GPUs:** Cooling processors in embedded systems. * **ASICs and FPGAs:** Used in networking equipment and telecommunications. * **Power Supplies:** Managing heat in industrial power modules. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 12.01 | | 200 | 4.50 | | 300 | 2.43 | | 400 | 1.64 | ---