The **ATS-07D-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family, which is widely used in PCB assembly for cooling integrated circuits (ICs) like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below is a breakdown of its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Dimensions** | 54.00mm x 54.00mm | | **Height** | 25.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Straight (optimized for airflow) | | **Thermal Resistance** | 7.14°C/W (at 100 LFM) | --- ### 2. Key Electronic Components & Features While the heatsink itself is a passive mechanical part, its "electronic" utility is defined by its interface and performance features: * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates the inclusion of a pre-applied high-performance thermal pad (often **T766**), which fills microscopic air gaps between the semiconductor and the aluminum to ensure maximum heat transfer. * **Push-Pin Mechanism:** It utilizes a spring-loaded push-pin system. This provides a precise "clamping force" (pressure) which is critical for maintaining electrical and thermal contact without cracking the delicate silicon die of an electronic chip. * **Anodized Coating:** The blue anodization is not just for aesthetics; it provides a layer of electrical insulation and increases the surface emissivity, which slightly improves radiative cooling. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where high-profile cooling is required for processors. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 7.14 | | 200 | 4.53 | | 300 | 3.42 | | 400 | 2.84 |