The **ATS-07D-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin)** | 20mm | | **Fin Style** | Cross-Cut (Square pins) | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the product's attributes: * **ATS-07**: Series designation (pushPIN™ Heat Sink). * **D**: Thermal resistance category or specific fin geometry. * **183**: Specific model/size identifier. * **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Revision or specific packaging/mounting kit version. --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design (Cross-Cut) The unit uses a **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. PushPIN™ Attachment System This component uses a specialized mounting system: * **Compression Springs:** Provides precise pressure to ensure maximum contact between the heat sink and the electronic chip. * **Brass/Plastic Pins:** Used to lock the heat sink into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "T766" listed in the specs is a phase-change material pre-applied to the base of the heat sink. When the electronic part heats up, the TIM softens to fill microscopic air gaps between the chip and the heat sink, significantly improving heat transfer efficiency. --- ### 4. Common Applications This heat sink is typically found in: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-speed processors that generate significant waste heat.