The **ATS-07D-18-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. While it is not an active electronic component (like a chip), it is a critical passive mechanical component used to manage the thermal profile of electronics. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Heat Sink Type** | Fine-Pitch (Straight Fin) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 11.77° C/W (@ 100 LFM) | --- ### 2. Breakdown of the Part Number The alphanumeric string provides specific details about the configuration: * **ATS**: The manufacturer (Advanced Thermal Solutions). * **07**: The specific design series or fin geometry. * **D**: Material/Performance grade. * **18**: Internal numbering for specific dimensions or pitch. * **C2**: Indicates the material/thermal interface material (TIM) or finish. In this case, it usually refers to a Blue Anodized finish. * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions Though it does not process signals, the ATS-07D-18-C2-R0 serves these vital roles in an electronic assembly: * **Thermal Dissipation**: It increases the surface area of a hot component (like a BGA processor, FPGA, or Power MOSFET), allowing heat to transfer into the ambient air. * **Reliability Enhancement**: By keeping the junction temperature of a semiconductor within safe limits, it prevents "thermal throttling" and extends the lifespan of the device. * **Mechanical Stability**: The push-pin attachment ensures a consistent pressure across the surface of the chip, which is necessary for the Thermal Interface Material (TIM) to work effectively. --- ### 4. Ideal Use Cases * **Computing**: Cooling VRMs or small chipsets on motherboards. * **Telecommunications**: Heat management for network switches and routers. * **Embedded Systems**: Industrial PCs where airflow is restricted and efficient fin design is required. ---