The **ATS-07D-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Breakdown ### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The "Straight Fin" design is optimized for high-density airflow environments. The **Blue Anodized** finish is not just aesthetic; it provides corrosion resistance and increases surface emissivity. ### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses a **Push-Pin** system. * **Plastic Pins:** Quickly snap into pre-drilled holes on the PCB. * **Compression Springs:** Ensure a consistent "Clamping Force" (pressure) between the heat sink and the electronic chip, which is critical for efficient heat transfer. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance material that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ## 3. Performance Metrics Thermal resistance (measured in °C/W) indicates how many degrees Celsius the component's temperature will rise for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.30 | | 300 (1.5 m/s) | 7.91 | | 500 (2.5 m/s) | 6.64 | | 700 (3.5 m/s) | 5.95 | --- ## 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Networking:** Dissipating heat from high-speed routers or switches. * **Power Supplies:** Managing temperatures of voltage regulators.